What about manufacturing equipment?

November 05, 2014

Teledyne AES is currently placing SMT components from 0201 chips up to large area array packages with ceramic packages.  Our 4 SMT lines have 100% Solder Paste Inspection (SPI), Automated Optical Inspection (AOI) both before and after reflow, inert atmosphere reflow, as well as automated and manual X-ray inspection.  We also have robust processes and equipment for wave soldering, selective soldering, heat sink bonding, box build, and conformal coating.  Capabilities for die attach, flip chip, gold ball bonding, etc are currently in development.

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Teledyne Advanced Electronic Solutions | EMS | 1425 Higgs Road, Lewisburg, TN 37091 | Terms and Conditions
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